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Blue Thermal Gap Filler Silicone Rubber Pads Providing Effective Thermal Management Solutions For Telecommunication Equipment

Blue Thermal Gap Filler Silicone Rubber Pads Providing Effective Thermal Management Solutions For Telecommunication Equipment

Detalhes do produto:
Lugar de origem: China
Marca: Ziitek
Certificação: UL and RoHs
Número do modelo: TIF100-50-05S
Documento: TIF100-50-05S_Data Sheet.pdf
Condições de Pagamento e Envio:
Quantidade de ordem mínima: 1000 peças
Preço: 0.1-10 USD/PCS
Detalhes da embalagem: caixa de 24*13*12cm
Tempo de entrega: 3-8 dias úteis
Termos de pagamento: T/T
Habilidade da fonte: 100.000 unidades/mês
Contato
Descrição de produto detalhada
Nome dos produtos: Almofadas de borracha de silicone térmicas azuis para preenchimento de lacunas, fornecendo soluções condutor térmico: 5,0 W/mK
Construção: Elastômero de silicone preenchido com cerâmica Dureza: 65/45 Costa 00
amostra: Amostra grátis Cor: Azul
Grossura: 0,010 "(0,25 mm) ~ 0,200" (5,0 mm) Densidade: 3,4g/cm³
Palavras-chave: Preenchimento de lacunas térmicas Aplicativo: Fornecendo soluções eficazes de gerenciamento térmico para equipamentos de telecomunicações

Blue Thermal Gap Filler Silicone Rubber Pads Providing Effective Thermal Management Solutions For Telecommunication Equipment

Company Profile 

Dongguan Ziitek Electronic Material and Technology Ltd. (ZIITEK) has been deeply involved in the field of heat conducting materials for many years, and is a high-tech enterprise integrating R&D, production and sales. Headquartered in Dongguan, with four production bases in Kunshan, Taiwan Province and Viet Nam, the global delivery capacity is stable and reliable. Mainly engaged in thermal conductive silica pads, thermal conductive graphite sheets, thermal conductive insulation materials, PCM phase change materials, thermal conductive plastics, thermal conductive silicone grease/paste, thermal conductive gel, thermal conductive epoxy potting glue, thermal conductive silicone adhesive, silicone foam, and silicon-free thermal pads. The core explosive heating plate is widely recognized by the market. Our products have passed ISO9001 and IATF16949 certification, and meet RoHS/UL standards, and are widely used in new energy, 5G, data center, automotive electronics and other fields.


Thermal Gap Filler Offering Superior Softness and Thermal Conductivity to Enhance Cooling and Reliability of Electronic Assemblies 2

Products description


The TIF®100-50-05S  Series is a well-balanced,general-purpose thermal pad.It offers high thermal conductivity and moderate hardness. This balanced design provides both excellent surface conformity and superior ease of use, making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic components. It is an ideal choice for addressing medium to high power heat dissipation needs, achieving the best balance between cost and performance.


Features

> Good thermal conductive 6.5W/mK
> Broad range of hardnesses available
> Outstanding thermal performance
> Easy release construction
> Electrically isolating
> High durability

Applications

> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules 
> Micro heat pipe thermal solutions
> Power tools
> Network communication products
> Electric vehicle batteries
> Computer CPU/GPU Cooling
> New energy vehicle power systems

Key attributes 


Typical Properties of TIF®100-50-05S Series
Property Value Test method
Color Blue Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 3.4 ASTM D792
Thickness Range(inch/mm) 0.010~0.020 0.030~0.200 ASTM D374
(0.25~0.50) (0.75~5.00)
Hardness 65 Shore 00 45 Shore 00 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ******
Breakdown Voltage(V/mm) ≥5500 ASTM D149
Dielectric Constant @1MHz 7.5 ASTM D150
Volume Resistivity(Ohm-meter) >1.0X1012  ASTM D257
Flame rating V-0 UL 94 (E331100)
Thermal conductivity(W/m-K) 5.0 ASTM D5470
5.0 ISO22007

 

Product Specifications


Standard Thickness:0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm).
Standard Size: 16" X16” (406 mm X406 mm).


Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).


The TIF®series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.

Blue Thermal Gap Filler Silicone Rubber Pads Providing Effective Thermal Management Solutions For Telecommunication Equipment 1


Packaging Details & Lead time


The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized


Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

Thermal Gap Filler Offering Superior Softness and Thermal Conductivity to Enhance Cooling and Reliability of Electronic Assemblies 1


Why Choose us ? 

 

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials.

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract.

5.Free sample offer.

6.Quality assurance contract.

 

FAQ

 

Q: Are you trading company or manufacturer ? 

A: We are manufacturer in China.


Q: What thermal conductivity test method was used to achieve the values given on the data sheets?

A: A test fixture is utilized that meets the specifications outlined in ASTM D5470.


Q:  Is GAP PAD offered with an adhesive?

A:  Currently, Most of thermal gap pad surface has double side natural inherent tack,Non-stick surface can also be treated according to customer's requirements

Contacto
Dongguan Ziitek Electronical Material and Technology Ltd.

Pessoa de Contato: Dana Dai

Telefone: +86 18153789196

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