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UL And RoHs Certificated High Conductivity 3W Self Adhesive Thermal Gap Pad For Computer CPU/GPU Cooling

UL And RoHs Certificated High Conductivity 3W Self Adhesive Thermal Gap Pad For Computer CPU/GPU Cooling

Detalhes do produto:
Lugar de origem: China
Marca: Ziitek
Certificação: UL & RoHS
Número do modelo: TIF100-30-11E
Condições de Pagamento e Envio:
Quantidade de ordem mínima: 1000 unidades
Preço: 0.1-10 USD/pcs
Detalhes da embalagem: caixas de 24*13*12cm
Tempo de entrega: 3-5 dias úteis
Termos de pagamento: T/T
Habilidade da fonte: 1000000 PCs/mês
Contato
Descrição de produto detalhada
Nome dos produtos: Almofada térmica autoadesiva de alta condutividade 3W com certificação UL e RoHs para resfriamento d Aplicativo: Resfriamento de CPU/GPU de computador
Grossura: Disponível em espessuras variadas Gravidade Específica: 30,0 g/cm3
Tensão de ruptura (V/mm)): ≥5500 Condutividade térmica: 3.0W/m-K
Cor: Cinza escuro Palavras-chave: Pad Gap térmico
Temperatura operacional: -40 ~ 200 ℃

UL And RoHs Certificated High Conductivity 3W Self Adhesive Thermal Gap Pad For Computer CPU/GPU Cooling

 

 Company Profile

Ziitek company is a high-tech enterprise dedicated to the R&D, manufacture and sales of thermal interface materials (TIMs). With rich experience in this field, we provide the latest, most effective one-step thermal management solutions. Our facility includes advanced production equipment, full test equipment, and fully automatic coating production lines capable of manufacturing high performance thermal products including:
Thermal gap pad
Thermal graphite sheet/film
Thermal double-sided tape
Thermal insulation pad
Thermal grease
Phase change material
Thermal gel
All products are compliant with UL94 V-0, SGS and ROHS standards.
Certifications: ISO9001:2015, ISO14001:2004, IATF16949:2016, IECQ QC 080000:2017, UL

Product introduction

 

TIF®100-30-11E Series is a wellbalanced, general-purpose thermal pad. It offers high thermal conductivity and moderate hardness. This balanced design provides both excellent surface conformity and superior ease of use, making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic components. It is an ideal choice for addressing medium to high power heat dissipation needs, achieving the best balance between cost and performance.

 

Features


> High thermal conductivity: 3.0W/mK

> Good softness and fillability
> Self-adhesive without the need for additional surface adhesives
> Good insulation performance

 

Applications

 

> Power tools
> Network communication products
> Electric vehicle batteries
> Computer CPU/GPU Cooling
> New energy vehicle power systems

> Signal communication
> New energy vehicle
> Motherboard chip
> Radiator
> AI Processors AI Servers

> Photovoltaic
> Signal communication
> New energy vehicle
> Motherboard chip
> Radiator

 

Typical Properties of TIF®100-30-11E Series
Property Value Test method
Color Dark Gray Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 3.0 ASTM D792
Thickness Range(inch/mm) 0.010~0.020 0.030~0.200 ASTM D374
(0.25~0.50) (0.75~5.00)
Hardness 65 Shore 00 35 Shore 00 ASTM 2240
Continuos Use Temp -40 to 200℃ ******
Breakdown Voltage(V/mm) ≥5500 ASTM D149
Dielectric Constant 7.0 MHz ASTM D150
Volume Resistivity >1.0X1012 Ohm-meter ASTM D257
Thermal Conductivity (W/m-K) 3.0 ASTM D5470
3.0 ISO22007
Fire rating V-0 UL 94 (E331100)

 

Product Specifications
Standard Thickness:0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size:16"X16" (406 mmX406 mm)


Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).


The TIF® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.

UL And RoHs Certificated High Conductivity 3W Self Adhesive Thermal Gap Pad For Computer CPU/GPU Cooling 0

Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

 

Why Choose us ?

 

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials.

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract.

5.Free sample offer.

6.Quality assurance contract.

 

FAQ:

 

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.

 

Q: How do I place an order?

A:1. Click the "Sent messages" button to continue with the process.

2. Fill out the message form by entering a subject line, and message to us.

This message should include any questions you might have about the products as well as your purchase requests.

3. Click the "Send" button when you are finished to complete the process and send your message to us

4. We will reply you as soon as possible with Email or online

 

Q: How do I request customized samples?

A: To request samples, you can leave us message on website, or just contact us by send email or call us.

 

Contacto
Dongguan Ziitek Electronical Material and Technology Ltd.

Pessoa de Contato: Dana Dai

Telefone: +86 18153789196

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