Name: High-Performance Low-Melting Laptop CPU Thermal Pad PCM Phase Change Material For Gap Filling
Brand: Dongguan Ziitek Electronical Material and Technology Ltd.
SKU: TIC800G
Price: 4.10 USD
Availability: InStock

Casa Produtos Material da mudança de fase do PCM

High-Performance Low-Melting Laptop CPU Thermal Pad PCM Phase Change Material For Gap Filling

Detalhes do produto:

Place of Origin:	China
Marca:	Ziitek
Certificação:	RoHS
Model Number:	TIC800G

Condições de Pagamento e Envio:

Minimum Order Quantity:	1000pcs
Preço:	0.1-10 USD/PCS
Packaging Details:	241312cm cartons
Delivery Time:	3-6 work days
Payment Terms:	T/T
Supply Ability:	1000000 pcs/month

Contato

Descrição de produto detalhada

Name:	High-Performance Low-Melting Laptop CPU Thermal Pad PCM Phase Change Material For Gap Filling	Applicatoin:	Laptop CPU
Color:	Gray	Keyword:	Phase Change Materials
Feature:	Low Thermal Resistant	Phase Change Softening Temperature:	50~60℃
Recommended Operating temp(℃）:	-40~125℃	Thermal conductivity:	5.0W/mK

High-Performance Low-Melting Laptop CPU Thermal Pad PCM Phase Change Material For Gap Filling

Dongguan Ziitek Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. We mainly produce: heat-conducting joint filler, low melting point thermal interface materials, heat-conducting insulator, heat-conducting adhesive tape, heat-conducting interface pad and heat-conducting grease, heat-conducting plastic, silicone rubber, silicone rubber foam, etc. We adhere to the business philosophy of "survival by quality, development by quality", and continue to provide the most efficient and best service for new and old customers with excellent quality in the spirit of rigor, pragmatism and innovation.

TIC^®800G Series is a high-performance, cost-effective thermal interface material featuringa unique grain-oriented structure that enables precise conformity to device surfaces,thereby enhancing the thermal conduction path and transfer efficiency. When the temperature exceeds its phase transition point of 50°℃, the material softens and undergoes phase change,effectively filling microscopic and uneven gaps between components to form a low thermal resistance interface,significantly improving heat dissipation performance.

Features
> Low thermal resistance
> Self-adhesive with no need for additional surface adhesives
> Low-pressure application environment

Applications
> Power conversion equipment

> Power supply and vehicle storage battery
> Large communication switch hardware

> LED TV, Lighting
> Laptop computer

Typical Properties of TIC^®800G Series
Product Name	TIC^®805G	TIC^®806G	TIC^®808G	TIC^®810G	TIC^®812G	Test Method
Color	Gray					Visual
Thickness	0.005"	0.006"	0.008"	0.010"	0.012"	ASTM D374
Thickness	(0.127mm)	(0152mm)	(0.203mm)	(0.254mm)	(0.305mm)	ASTM D374
Density	2.6g/cc					ASTM D792
Recommended Operating Temperature (℃)	-40℃～125℃					Ziitek Test Method
Phase Change Softening Temperature(℃)	50℃~60℃					Ziitek Test Method
Thermal Conductivity	5.0 W/mK					ASTM D5470
Thermal Impedance(℃-cm²/W) @50 psi	0.014	0.018	0.02	0.024	0.028	ASTM D5470

Standard Thickness:

0.005"(0.127 mm),0.006"(0.152 mm), 0.008"(0.203 mm),0.010"(0.254 mm),0.012" (0.305 mm)

For other thickness options, please contact us.

Standard size: 10”× 16"(254 mm x 406 mm),16”x 400'(406 mm x 122 m).
TIC^®800G series is supplied with a white release liner and backing pad.

Die-cutting with half-cut processing can include pull tabs.custom-shaped samples are also available.

Pressure-Sensitive Adhesive. lt is not applicable to TIC^®800G series products.

Reinforcement Material: No reinforcement materialrequired.

High-Performance Low-Melting Laptop CPU Thermal Pad PCM Phase Change Material For Gap Filling 0

Independent R&D team

Q: How do I place an order?

A:1. Click the "Sent messages" button to continue with the process.

2. Fill out the message form by entering a subject line, and message to us.

This message should include any questions you might have about the products as well as your purchase requests.

3. Click the "Send" button when you are finished to complete the process and send your message to us.

4. We will reply you as soon as possible with Email or online.

etiqueta:

supere o material da mudança de fase,

almofada térmica da mudança de fase,

Material térmico da mudança de fase

Contacto

Dongguan Ziitek Electronical Material and Technology Ltd.

Pessoa de Contato: Dana Dai

Telefone: +86 18153789196

Outros Produtos

refrigerar material do portátil dos semicondutores do poder da almofada da mudança de fase do PCM 2.2g/Cc

Palavra-chave: Mudança de fase térmica amarela compatível com RoHS

Aplicação: Semicondutores de potência

Densidade: 2,2g/cc

Condutividade térmica: 0,95 W/mK

Material de mudança de fase PCM para equipamentos de comunicações e estações sem fio

Nome dos produtos: Material de mudança de fase PCM para equipamentos de comunicações e estações sem fio

Palavra chave: Material da mudança de fase

Applicatoin: Equipamento de comunicações e estações sem fio

temperatura de mudança de fase: 50℃~60℃

Material de mudança de fase de isolamento térmico condutor de alta tensão para módulos electrónicos

Nome: Material de mudança de fase de isolamento térmico condutor de alta tensão para módulos electrónicos

Palavra chave: Material de mudança de fase condutor térmico

Cor: âmbar claro

Material: pcm com filme Kapton

Modulos de memória de baixo ponto de fusão térmico

Name: Gray PCM Phase Change Material Thermal Low Melting Point Memory Modules

Cores: cinza

Keyword: Phase Change Materials

Feature: Low melting point

Material de interface térmica de baixa fusão Materiais de mudança de fase Pad térmico para equipamento de controle de motor elétrico

Name: Low-Melting Thermal Interface Material Phase Change Materials Thermal Pad For Electric Motor Control Equipment

Applicatoin: Electric Motor Control Equipment

Color: Light Amber

Keyword: Phase Change Materials

Materiais de mudança de fase PCM de baixa fusão a altas temperaturas de 1,5 W para baterias

Nome: Materiais de mudança de fase PCM de baixa fusão a altas temperaturas de 1,5 W para baterias

Applicatoin: Bateria da CPU da GPU do laptop

cor: Amarelo

Palavra chave: Materiais de mudança de fase

5.0W Alta condutividade térmica de mudança de fase de silicone Pad Sheet para laptop CPU GPU

Nome: 5.0W Alta condutividade térmica de mudança de fase de silicone Pad Sheet para laptop CPU GPU

Applicatoin: CPU de laptop GPU

Cores: Cinzento

Palavra chave: Pad de silicone de mudança de fase