PHASE CHANGE MATERIAL TIC800P

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PHASE CHANGE MATERIAL TIC800P

相变化

April 13, 2021

Conexão de Categoria: Material da mudança de fase do PCM

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Tags:

#supere o material da mudança de fase #almofada térmica da mudança de fase #Material térmico da mudança de fase

Brief: Discover the Gray PCM Phase Change Material Thermal Low Melting Point Memory Modules, ideal for high-performance thermal management in electronics. With excellent thermal conductivity and durability, these modules are perfect for microprocessors, memory modules, and more.

Related Product Features:

Baixa resistência térmica de 0,014°C-in2/W para uma dissipação de calor eficiente.
Naturally tacky at room temperature, eliminating the need for adhesives.
No heat sink preheating required, simplifying installation.
Durable performance with no degradation after 1,000 hours at 130℃.
Available in multiple thicknesses: 0.005”, 0.008”, 0.010”, and 0.012”.
Thermal conductivity of 5.0 W/mK for superior heat transfer.
Suitable for a wide temperature range from -25℃ to 125℃.
Autoportante e flexível, sem necessidade de componentes de reforço.

Perguntas Frequentes:

What is the phase change softening temperature of the TIC™800G Series?

The TIC™800G Series begins to soften and flow at 50℃ to 60℃, filling microscopic irregularities for reduced thermal resistance.
Can the TIC™800G Series be used without adhesive?

Yes, the material is naturally tacky at room temperature, so no adhesive is required for installation.
What applications are suitable for the TIC™800G Series?

It is ideal for high-frequency microprocessors, notebooks, desktop PCs, memory modules, cache chips, and IGBTs.