Black soft thermal pads TIF100-01

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Black soft thermal pads TIF100-01

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January 30, 2021

Conexão de Categoria: Almofada térmica do processador central

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Tags:

#almofada térmica do gpu do portátil #almofada refrigerando do processador central #almofada térmica do caderno

Brief: Discover the TIF100-01US Series, a high-quality heat insulation silicone CPU thermal pad with various thickness options. Perfect for CPUs, display cards, and more, this thermal pad offers outstanding thermal performance, moldability, and softness for low-stress applications. Learn about its features and applications in this video.

Related Product Features:

Outstanding thermal performance with 1.5 W/mK thermal conductivity.
Moldável para peças complexas, garantindo o melhor ajuste e desempenho.
Soft and compressible, ideal for low-stress applications.
Naturally tacky, eliminating the need for additional adhesive coating.
Desempenho estável numa ampla gama de temperaturas (-40°C a 160°C).
Compliant with UL94V0 flame rating for safety.
Available in various thicknesses from 0.25mm to 5.0mm.
Can be reinforced with fiberglass for added durability.

Perguntas Frequentes:

What is the thermal conductivity of the TIF100-01US Series thermal pad?

The TIF100-01US Series thermal pad has a thermal conductivity of 1.5 W/mK, ensuring efficient heat dissipation.
What temperature range can the TIF100-01US Series thermal pad withstand?

This thermal pad can operate stably in temperatures ranging from -40℃ to 160℃, making it suitable for various applications.
Are there adhesive options available for the TIF100-01US Series thermal pad?

Yes, you can request adhesive on one side (A1 suffix) or both sides (A2 suffix) for easy installation.