Brief: Discover the high-performance 94 V0 1.25W/MK thermal gap pad, designed for high-speed mass storage drives. This low-cost, versatile solution offers excellent thermal conductivity and is available in thicknesses from 0.25mm to 5.0mm. Perfect for applications like LED TVs, CPUs, and telecommunication hardware.
Related Product Features:
Boa condutividade térmica a 1,25 W/mK para uma dissipação de calor eficiente.
Available in various thicknesses from 0.25mm to 5.0mm to suit different needs.
UL recognized for safety and reliability.
High tack surface reduces contact resistance for better performance.
Electrically isolating material, ideal for high-voltage applications.
Fire rating of 94 V0 ensures safety in demanding environments.
Can be customized with pressure-sensitive adhesive on one or both sides.
As opções de reforço incluem fibra de vidro para maior durabilidade.
Perguntas Frequentes:
What is the thermal conductivity of the TIF2100-01U Series gap pad?
The TIF2100-01U Series offers a thermal conductivity of 1.25W/mK, ensuring efficient heat transfer for high-speed mass storage drives and other applications.
What thickness options are available for this thermal gap pad?
The gap pad is available in thicknesses ranging from 0.25mm to 5.0mm, with standard options including 0.51mm, 0.76mm, 1.27mm, and more to fit various requirements.
Is the TIF2100-01U Series suitable for high-voltage applications?
Yes, the TIF2100-01U Series is an electrically isolating material, making it safe for use in high-voltage applications where isolation between heat sinks and bare-leaded devices is required.