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High Dielectric Strength Silicone-Based Gap Pad Filler For Consumer Electronics Cooling

High Dielectric Strength Silicone-Based Gap Pad Filler For Consumer Electronics Cooling

Detalhes do produto:
Lugar de origem: China
Marca: Ziitek
Certificação: UL & RoHS
Número do modelo: TIF100-15-11S
Condições de Pagamento e Envio:
Quantidade de ordem mínima: 1000 unidades
Preço: 0.1-10 USD/PCS
Detalhes da embalagem: caixas de 24*13*12cm
Tempo de entrega: 3-5 dias úteis
Termos de pagamento: T/T
Habilidade da fonte: 1000000 PCs/mês
Contato
Descrição de produto detalhada
Nome dos produtos: Enchimento de almofada de lacuna à base de silicone de alta resistência dielétrica para resfriamento Cor: Cinza escuro
Constante dielétrica: 4.5 MHz Palavras-chave: Preenchimento de lacunas
Aplicativo: Resfriamento de eletrônicos de consumo Grossura: 0,25-5,0mmT(0,010"~0,20")
Tensão de ruptura (V/mm): ≥5500 Classificação de fogo: 94 V0
Condutividade térmica: 1,5 W/mK

High Dielectric Strength Silicone-Based Gap Pad Filler For Consumer Electronics Cooling

 

The TIF®100-15-11S Series is a well-balanced, general-purpose thermal pad. It offers good thermal conductivity and moderate hardness. This balanced design provides both excellent surface conformity and superior ease of use, making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic components.

 

Company Profile

 

Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!


Features


> Good thermal conductive: 1.5W/mK
> Available in varies thicknesses
> Broad range of hardnesses available
> Outstanding thermal performance

> Easy release construction
> Electrically isolating
> High durability


Applications


> Micro heat pipe thermal solutions
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
> CPU
> Display card
> Mainboard/mother board

 

Typical Properties of TIF®100-15-11S Series
Property Value Test method
Color Dark Gray Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 2.3 ASTM D792
Thickness Range(inch/mm) 0.010~0.020 0.030~0.200 ASTM D374
(0.25~0.5) (0.75~5.0)
Hardness 65 Shore 00 45 Shore 00 ASTM 2240
Continuos Use Temp -40 to 200℃ ***
Breakdown Voltage(V/mm) ≥5500 ASTM D149
Dielectric Constant 4.5 MHz ASTM D150
Volume Resistivity >1.0X1012 Ohm-meter ASTM D257
Thermal Conductivity (W/m-K) 1.5 ASTM D5470
1.5 ISO22007
Fire rating V-0 UL 94 (E331100)
 
Product Specifications

Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm).
Standard Size: 16" X16" (406 mm X406 mm).

Component Codes:

Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).
 
The TIF® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.

High Dielectric Strength Silicone-Based Gap Pad Filler For Consumer Electronics Cooling 0

Advantage

 

Ziitek has independent R&D team. This team is experience, rigorous and pragmatic.They undertake the core research and development tasks of Ziitek thermal conductive materials. With well-equipped testing equipment, we Ziitek can also do some tests with customers' samples, so we can find a more suitable Ziitek materials for every customer.

 

Independent R&D team

 

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Contacto
Dongguan Ziitek Electronical Material and Technology Ltd.

Pessoa de Contato: Dana Dai

Telefone: +86 18153789196

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