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Good Heat Dissipation Ultra Soft 7.5W Silicone Thermal Pad For AI Processors AI Servers

Good Heat Dissipation Ultra Soft 7.5W Silicone Thermal Pad For AI Processors AI Servers

Detalhes do produto:
Lugar de origem: China
Marca: Ziitek
Certificação: UL & RoHS
Número do modelo: TIF700PUS
Condições de Pagamento e Envio:
Quantidade de ordem mínima: 1000 unidades
Preço: 0.1-10 USD/PCS
Detalhes da embalagem: caixas de 24*23*12cm
Tempo de entrega: 3-5 dias úteis
Termos de pagamento: T/T
Habilidade da fonte: 1000000 PCs/mês
Contato
Descrição de produto detalhada
Nome dos produtos: Boa almofada térmica ultra macia do silicone 7.5W da dissipação de calor para servidores do AI dos p Construção: Elastômero de silicone cheio de cerâmica
Aplicação: Servidores de IA Processadores de IA Faixa de espessura: 0,5-5,0mmT
Classificação de incêndio: Ul94 V-0 Constante dielétrica @1MHz: 4.5
Cor: Cinza Condutividade Térmica: 7.5W/m-K
Tensão de ruptura (V/mm)): ≥5500 Palavras-chave: almofada térmica do silicone

Good Heat Dissipation Ultra Soft 7.5W Silicone Thermal Pad For AI Processors AI Servers

 

 Company Profile

 

Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!

 

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL

 

The TIF®700PUS Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with an exceptionally gel-like softness, achieving a low-stress perfect fit. It is suitable for addressing issues in high-precision assemblies, such as large tolerances, uneven surfaces, and the susceptibility of delicate components to mechanical damage.

Features

> Excellent thermal conductivity:7.5 W/mK
> Super soft and highly compliant
> Self-adhesive without the need for additional surface adhesives
> High insulation performance

Applications

> Al Servers
> Semiconductor Packaging
> Low-Altitude Aircraft
> Optical Communication Products
> 5G Base Stations
> Unmanned aerial vehicle(UAV)
> Photovoltaic
> Signal communication
> New energy vehicle
> Motherboard chip
> Radiator
 
Typical Properties of TIF®700PUS Series
Property Value Test method
Color Gray Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 3.2 ASTM D792
Thickness Range(inch/mm)

0.020~0.030

(0.50~0.5)

0.040~0.200 (1.0~5.0) ASTM D374
Hardness (Shore OO) 70 20 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ***
Breakdown Voltage(V/mm) ≥5500 ASTM D149
Dielectric Constant 4.5 MHz ASTM D150
Volume Resistivity >3.5 X1012 Ohm-meter ASTM D257
Flame rating V-0 UL 94 (E331100)
Thermal conductivity 7.5 W/m-K ASTM D5470
7.5 W/m-K ISO22007

 

Product Specifications

Standard Thickness:0.020" (0.50 mm)~0.200" (5.00 mm) with increments of 0.01" (0.25 mm)
Standard Size: 16"X 16" (406 mmX406 mm)

Component Codes:
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).

The TIF® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.

 

Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

 

Good Heat Dissipation Ultra Soft 7.5W Silicone Thermal Pad For AI Processors AI Servers 0

Why Choose us ?

 

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials.

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract.

5.Free sample offer.

6.Quality assurance contract.

 

Ziitek Culture

 

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

 

Contacto
Dongguan Ziitek Electronical Material and Technology Ltd.

Pessoa de Contato: Dana Dai

Telefone: +86 18153789196

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