Brief: Discover the TIF400 Thermal Pad, a high-performance 2W/MK silicon thermal pad designed for telecommunication hardware. This yellow thermal gap pad offers excellent thermal conductivity, moldability, and low-stress applications. Perfect for RDRAM memory modules, automotive engine control units, and more.
Related Product Features:
Boa condutividade térmica com desempenho de 2,0 W/mK.
Moldável para peças complexas e espaços apertados.
Soft and compressible for low-stress applications.
Naturally tacky, eliminating the need for adhesive coatings.
Disponível em várias espessuras de 0,5mm a 5,0mm.
Electrically isolating material for high-voltage applications.
UL94 V-0 flame rating for safety compliance.
Adequado para hardware de telecomunicações e dispositivos com iluminação LED.
Perguntas Frequentes:
What is the thermal conductivity of the TIF400 Thermal Pad?
The TIF400 Thermal Pad has a thermal conductivity of 2.0 W/mK, making it highly effective for heat dissipation.
Can the TIF400 Thermal Pad be used in high-voltage applications?
Yes, the TIF400 is an electrically isolating material, making it suitable for high-voltage, bare-leaded devices.
What thickness options are available for the TIF400 Thermal Pad?
The TIF400 is available in thicknesses ranging from 0.5mm to 5.0mm, with standard and custom options upon request.