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Thermal Gap Filler 6.0W/mK Silicone Thermal Pad Designed For Heat Transfer And Reduced Thermal Resistance In Electronic Devices

Thermal Gap Filler 6.0W/mK Silicone Thermal Pad Designed For Heat Transfer And Reduced Thermal Resistance In Electronic Devices

Detalhes do produto:
Lugar de origem: China
Marca: Ziitek
Certificação: UL and RoHs
Número do modelo: Almofada térmica TIF100-60-11U
Documento: TIF100-60-11U_Data Sheet.pdf
Condições de Pagamento e Envio:
Quantidade de ordem mínima: 1000 peças
Preço: 0.1-10 USD/PCS
Detalhes da embalagem: caixa de 24*13*12cm
Tempo de entrega: 3-8 dias úteis
Termos de pagamento: T/T
Habilidade da fonte: 100.000 unidades/mês
Contato
Descrição de produto detalhada
Nome dos produtos: Almofada térmica de silicone para preenchimento de lacunas térmicas 6.0W/mK projetada para transferê Número do modelo: TIF100-60-11U
palavra-chave: Almofada Térmica de Silicone Constante dielétrica@1MHz: 7,0
Tensão de ruptura (V/mm): ≥5500 Cor: Cinza escuro
Condutividade térmica: 6.0W/mK Aplicativo: Para transferência de calor e resistência térmica reduzida em dispositivos eletrônicos
amostra: livre

Thermal Gap Filler 6.0W/mK Silicone Thermal Pad Designed For Heat Transfer And Reduced Thermal Resistance In Electronic Devices


 

Company Profile

 

Dongguan Ziitek Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. We mainly produce: heat-conducting joint filler, low melting point thermal interface materials, heat-conducting insulator, heat-conducting adhesive tape, heat-conducting interface pad and heat-conducting grease, heat-conducting plastic, silicone rubber, silicone rubber foam, etc. We adhere to the business philosophy of "survival by quality, development by quality", and continue to provide the most efficient and best service for new and old customers with excellent quality in the spirit of rigor, pragmatism and innovation.

 

Products ddescription 

 

Ziitek TIF®100-60-11U Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with exceptional gel-level softness, achieving a perfectly low-stress fit. It is suitable for addressing issues such as large tolerances, uneven surfaces, and the susceptibility of precision components to mechanical damage in high-precision assemblies.


Features: 


> Good thermal conductive: 6.0W/mK
> Thickness: 0.010~0.200 (0.25mm~5.0mmT)
> Colour: gray
> Easy release construction
> Electrically isolating
> High durability
> Super soft and highly compliant

Applications: 

>  Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
> Power tools
> Network communication products
> Electric vehicle batteries
> Computer CPU/GPU Cooling
> New energy vehicle power systems
> Heat pipe thermal solutions
> Memory Modules 
> Mass storage devices 

Key attributes 

Typical Properties of TIF®100-60-11U Series
Property Value Test method
Color Dark Gray Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 3.4 ASTM D792
Thickness Range(inch/mm) 0.010~0.020 0.030~0.200 ASTM D374
(0.25~0.50) (0.75~5.0)
Hardness 65 Shore 00 27 Shore 00 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ******
Breakdown Voltage(V/mm) ≥5500 ASTM D149
Dielectric Constant 7.0 MHz ASTM D150
Volume Resistivity >1.0X1012 Ohm-meter ASTM D257
Flame rating V-0 UL 94 (E331100)
Thermal conductivity 6.0 W/m-K ASTM D5470
6.0 W/m-K ISO22007

 

Product Specifications


Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm).
Standard Size: 16"×16" (406 mmX406 mm).


Component Codes:


Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).

 
The TIF series is available in custom shapes and various forms.
For other thicknesses or more information,please contact us.

Thermal Gap Filler 6.0W/mK Silicone Thermal Pad Designed For Heat Transfer And Reduced Thermal Resistance In Electronic Devices 0

Our services

 

Online-service : 12 hours , Inquiry reply within fastest.


Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).

Well-trained & experienced staff are to answer all your inquiries in English of course.

Standard Export Carton Or Marked With Customer's Information Or Customized.

Provide free samples

 

After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.

we will help you to deal with it and give you satisfactory solution.


FAQ: 


Q: Are you trading company or manufacturer ? 

A: We are manufacturer in China.


Q: How do I place an order? 

A:1. Click the "Sent messages" button to continue with the process. 

2. Fill out the message form by entering a subject line, and message to us.  

This message should include any questions you might have about the products as well as your purchase requests.

3. Click the "Send" button when you are finished to complete the process and send your message to us 

4. We will reply you as soon as possible with Email or online 


Q: How do I request customized samples? 

A: To request samples, you can leave us message on website, or just contact us by send email or call us.

Contacto
Dongguan Ziitek Electronical Material and Technology Ltd.

Pessoa de Contato: Dana Dai

Telefone: +86 18153789196

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