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Silicone Thermal Pad Thermal Interface Gap Filler Pads for Enhanced Heat Dissipation in Electronic Industrial Components

Silicone Thermal Pad Thermal Interface Gap Filler Pads for Enhanced Heat Dissipation in Electronic Industrial Components

Detalhes do produto:
Lugar de origem: China
Marca: Ziitek
Certificação: UL and RoHs
Número do modelo: TIF100-30-10S
Documento: TIF100-30-10S_Data Sheet.pdf
Condições de Pagamento e Envio:
Quantidade de ordem mínima: 1000 peças
Preço: 0.1-10 USD/PCS
Detalhes da embalagem: caixa de 24*13*12cm
Tempo de entrega: 3-8 dias úteis
Termos de pagamento: T/T
Habilidade da fonte: 100.000 unidades/mês
Contato
Descrição de produto detalhada
Nome dos produtos: Almofadas térmicas de preenchimento de lacuna de interface térmica de silicone para dissipação de ca Construção: Elastômero de silicone preenchido com cerâmica
Dureza: 65/45 Costa 00 Cor: Cinza
Aplicativo: Dissipação de calor aprimorada em componentes eletrônicos industriais condutor térmico: 3.0 W/mK
Grossura: 0,010 "(0,25 mm) ~ 0,200" (5,0 mm) Densidade: 30,15 g/cm3
Palavras-chave: Almofada Térmica de Silicone amostra: Amostra grátis

Silicone Thermal Pad Thermal Interface Gap Filler Pads for Enhanced Heat Dissipation in Electronic Industrial Components


Company Profile 

Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material,  thermal grease etc. UL94 V-0, SGS and ROHS are compliant. 

Products description

TIF®100-30-10S Series is a well-balanced,general-purpose thermal pad. It offers good thermal conductivity and moderate hardness. This balanced design provides both excellent surface conformity and superior ease of use, making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic components. It is an ideal choice for addressing medium to high power heat dissipation needs, achieving the best balance between cost and performance.


Features

> Good thermal conductive 
> Moldability for complex parts
> Broad range of hardnesses available
> Outstanding thermal performance
> High tack surface reduces contact resistance
> RoHS compliant
> UL recognized

Applications

> Embedded Motherboard
> Industrial visual inspection equipment
> Graphics card cooling module
> Charging pile power module
> Central control screen
> Power tools
> Network communication products
> Electric vehicle batteries
> Computer CPU/GPU Cooling
> New energy vehicle power systems

 

Key attributes


Typical Properties of TIF®100-30-10S Series
Property Value Test method
Color Gray Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 3.15 ASTM D792
Thickness Range(inch/mm) 0.010~0.020 0.030~0.200 ASTM D374
(0.25~0.50) (0.75~5.00)
Hardness 65 Shore 00 45 Shore 00 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ******
Breakdown Voltage(V/mm) ≥5500 ASTM D149
Dielectric Constant @1MHz 5.0 ASTM D150
Volume Resistivity(Ohm-meter) >1.0X1012  ASTM D257
Flame rating V-0 UL 94 (E331100)
Thermal conductivity(W/m-K) 3.0 ASTM D5470
3.0 ISO22007

 

Product Specifications


Standard Thickness:0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm).
Standard Size: 16" X16” (406 mm X406 mm).


Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).


The TIF®series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.

Silicone Thermal Pad Thermal Interface Gap Filler Pads for Enhanced Heat Dissipation in Electronic Industrial Components 0


Packaging Details & Lead time


The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized


Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

Silicone Thermal Pad Thermal Interface Gap Filler Pads for Enhanced Heat Dissipation in Electronic Industrial Components 1


Ziitek Culture

 

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete  teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

 

FAQ

 

Q: What thermal conductivity test method was used to achieve the values given on the data sheets?

A: A test fixture is utilized that meets the specifications outlined in ASTM D5470.


Q: Is GAP PAD offered with an adhesive?

A: Currently, Most of thermal gap pad surface has double side natural inherent tack,Non-stick surface can also be treated according to customer's requirements.

 

Q: What's the thermal conductivity test method given on the data sheet ? 

A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.  


Q: How to find a right thermal conductivity for my applications 

A: It depends on the watts of power source , ability of heat dissipation. Please tell us your detailed applications and the power, so we can recommend most suitable thermal conductive materials. 

Contacto
Dongguan Ziitek Electronical Material and Technology Ltd.

Pessoa de Contato: Dana Dai

Telefone: +86 18153789196

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