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Thermal GAP PAD Materials Thermally Gap Pad For Computer CPU GPU Cooling

Thermal GAP PAD Materials Thermally Gap Pad For Computer CPU GPU Cooling

Detalhes do produto:
Lugar de origem: China
Marca: Ziitek
Certificação: UL & RoHS
Número do modelo: TIF100-50-50E
Condições de Pagamento e Envio:
Quantidade de ordem mínima: 1000 unidades
Preço: 0.1-10 USD/PCS
Detalhes da embalagem: 24*13*12cm de caixas
Tempo de entrega: 3-5 dias úteis
Termos de pagamento: T/T
Habilidade da fonte: 1000000 PCs/mês
Contato
Descrição de produto detalhada
Nome dos produtos: Os materiais térmicos da ALMOFADA de GAP almofada termicamente de Gap para refrigerar do processador Aplicação: Resfriamento de GPU de CPU de computador
Condutividade térmica: 5.0W/m-k Cor: Cinza escuro
Gravidade Específica: 3.2 g/cc Palavras-chave: Almofada de lacuna térmica
Tensão de quebra dielétrica: > 5500 Vac Grossura: 0.25-5.0mm
Construção: Elastômero de silicone preenchido com cerâmica

Thermal GAP PAD Materials Thermally Gap Pad For Computer CPU GPU Cooling

 

Company Profile

 

Dongguan Ziitek Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. We mainly produce: heat-conducting joint filler, low melting point thermal interface materials, heat-conducting insulator, heat-conducting adhesive tape, heat-conducting interface pad and heat-conducting grease, heat-conducting plastic, silicone rubber, silicone rubber foam, etc. We adhere to the business philosophy of "survival by quality, development by quality", and continue to provide the most efficient and best service for new and old customers with excellent quality in the spirit of rigor, pragmatism and innovation.

 

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL

 

Product discription

 

TIF®500-50-11US Series is an ultra soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with extreme gel grade flexibility to achieve a perfect fit with low stress. It is suitable for solving problems such as large tolerances,uneven surfaces, and susceptibility of precision components to mechanical damage in high-precision assembly.

 

Features:


> High thermal conductivity: 5.0W/mK

> Good Flexibility And Fillability
> Self-adhesive without the need for additional surface adhesives
> Good insulation performance

> Available in varies thicknesses

> Ultra soft and highly compliant


Applications:


> Power tools
> Network communication products
> Electric vehicle batteries
> Computer CPU/GPU Cooling
> New energy vehicle power systems
> Display card
> Mainboard/mother board
> Notebook
> Power supply

> Routers
> Medical Devices
> Auditioning electronic products
> unmanned aerial vehicle(UAV)
> Photovoltaic
> Signal communication
> Motherboard chip
> Radiator

Typical Properties of TIF®500-50-11US Series
Property Value Test method
Color Dark gray Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 3.2 ASTM D792
Thickness Range(inch/mm) 0.010~0.020 0.030~0.200 ASTM D374
(0.25~0.50) (0.75~5.0)
Hardness 65 Shore 00 20 Shore 00 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ******
Breakdown Voltage(V/mm) ≥5500 ASTM D149
Dielectric Constant 6.0 MHz ASTM D150
Volume Resistivity >1.0X1012 Ohm-meter ASTM D257
Flame rating V-0 UL 94 (E331100)
Thermal conductivity 5.0 W/m-K ASTM D5470
5.0 W/m-K ISO22007

Product Specifications


Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16" X16" (406 mm x 406 mm)


Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).


The TIF® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.

Thermal GAP PAD Materials Thermally Gap Pad For Computer CPU GPU Cooling 0
Packaging Details & Lead time
 
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
 
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated

 

Our services

 

Online-service : 12 hours , Inquiry reply within fastest.


Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).

Well-trained & experienced staff are to answer all your inquiries in English of course.

Standard Export Carton Or Marked With Customer's Information Or Customized.

Provide free samples

 

After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.

we will help you to deal with it and give you satisfactory solution.

 

FAQ:

 

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.

 

Q: Is GAP PAD offered with an adhesive?

A: Currently, Most of thermal gap pad surface has double side natural inherent tack,Non-stick surface can also be treated according to customer's requirements.

 

Q:Is there promotion price for big buyer?

A:Yes, we do have promotion price for big buyer. Please send us email for inquiry.

 

Q: What thermal conductivity test method was used to achieve the values given on the data sheets?

A: A test fixture is utilized that meets the specifications outlined in ASTM D5470.

Contacto
Dongguan Ziitek Electronical Material and Technology Ltd.

Pessoa de Contato: Dana Dai

Telefone: +86 18153789196

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