Name: High Conductivity Thermal Gel 5.0W/MK Insulation Thermal Conductive Gel Suitable For PCB Applications
Brand: Dongguan Ziitek Electronical Material and Technology Ltd.
SKU: TIF050-11-1
Price: 49.10 USD
Availability: InStock

Casa Produtos Gel condutor térmico

High Conductivity Thermal Gel 5.0W/MK Insulation Thermal Conductive Gel Suitable For PCB Applications

Detalhes do produto:

Lugar de origem:	CHINA
Marca:	Ziitek
Certificação:	UL
Número do modelo:	TIF050-11-1

Condições de Pagamento e Envio:

Quantidade de ordem mínima:	1000 tubos
Preço:	0.1-100USD/KG
Detalhes da embalagem:	300cc/PCS, 6PCS/caixa
Tempo de entrega:	3-8 dias de trabalho
Termos de pagamento:	T/T.
Habilidade da fonte:	10000KG/Month

Contato

Descrição de produto detalhada

Nome dos produtos:	Gel condutor térmico da isolação térmica alta do gel 5.0W/MK da condutibilidade apropriado para apli	Gravidade específica:	3.25 g/cc
Cor:	Cinza escuro	Materail:	Materiais cerâmicos de silício
Tensão de ruptura (V/mm):	≥6000	Condutividade térmica:	5.0W/m-k
Palavra -chave:	Gel térmico	Aplicação:	Aplicações de PCB
Constante dielétrica @1MHz:	7,7

High Conductivity Thermal Gel 5.0W/MK Insulation Thermal Conductive Gel Suitable For PCB Applications

TIF^®050-11-1 is a thermally conductive paste with excellent interface thermal resistance characteristics and outstanding plasticity, capable of fully meeting the strict thermal management performance requirements of various designs; this material has extremely low hardness, possesses free-forming ability, and is easy to construct and assemble, demonstrating good stability in high-temperature environments. Its low-stress characteristics are particularly suitable for electronic devices that require high precision and high reliability, effectively reducing the mechanical stress on sensitive components during assembly and operation, ensuring the long-term stable operation of products in various application environments.

Feature

> Thermal conductivity: 5.0 W/mK
> Low stress, protect sensitive components.
> Strong plasticity. good stability
> Superior dielectric properties

Application

> Power module
> LED backlight module, LED lighting
> High speed hardware driver
> Micro heat pipe
> Vihicel enginee controller
> Telecom industry
> Semiconductor automatic laboratory equipment

TIF^®050-11-1 Typical Properties
Property	Value	Test method
Color	Dark Gray	Visual
Construction & Composition	Ceramic filled silicon material	******
Density(g/cm³)	3.25g/c	ASTM D792
Thermal conductivity	5.0W/mK	ASTM D5470
Breakdown Voltage (V/mm)	≥6000	ASTM D149
Dielectric constant @1MHz	7.7	ADTM D150
Flame Rating	V-0	UL 94
Volume resistivity(Ohm.cm)	8.0 X 10¹³	ASTM D257

Packing details

30 cc/pc, 98 pc/box;

300 cc/pc , 6 pc/box

We offer the custom packaged in syringes for automated despensing applications.

Please contact us for confirming.

Company Profile

With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.

Why Choose us ?

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials.

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract.

5.Free sample offer.

6.Quality assurance contract.

Ziitek Culture

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

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